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p-to220-3-1 p-to252-3-1 p-to263-3-1 low-drop voltage regulator tle 4274 data sheet version 1.3 1 2000-10-10 features output voltage 5 v, 8.5 v or 10 v output voltage tolerance ? 4% current capability 400 ma low-drop voltage very low current consumption short-circuit proof reverse polarity proof suitable for use in automotive electronics smd = surface mounted device functional description the tle 4274 is a low-drop voltage regulator in a to220 package. the ic regulates an input voltage up to 40 v to v qrated = 5.0 v (v50), 8.5 v (v85) and 10 v (v10). the maximum output current is 400 ma. the ic is short-circuit proof and incorporates temperature type ordering code package tle 4274 v10 q67000-a9258 p-to220-3-1 tle 4274 v85 q67000-a9257 p-to220-3-1 tle 4274 v50 q67000-a9256 p-to220-3-1 tle 4274 d v50 q67006-a9331 p-to252-3-1 tle 4274 g v10 q67006-a9261 p-to263-3-1 tle 4274 g v50 q67006-a9259 p-to263-3-1 tle 4274 g v85 q67006-a9260 p-to263-3-1 protection that disables the ic at over temperature. a 3.3 v and 2.5 v version is also available. for information about the low output voltage types please refer to the data sheet tle 4274 / 3.3 v; 2.5 v.
tle 4274 data sheet version 1.3 2 2000-10-10 dimensioning information on external components the input capacitor c i is necessary for compensating line influences. using a resistor of approx. 1 ? in series with c i , the oscillating of input inductivity and input capacitance can be damped. the output capacitor c q is necessary for the stability of the regulation circuit. stability is guaranteed at values c q 22 f and an esr of 3 ? within the operating temperature range. circuit description the control amplifier compares a reference voltage to a voltage that is proportional to the output voltage and drives the base of the series transistor via a buffer. saturation control as a function of the load current prevents any oversaturation of the power element. the ic also includes a number of internal circuits for protection against: overload overtemperature reverse polarity
tle 4274 data sheet version 1.3 3 2000-10-10 figure 1 pin configuration (top view) pin definitions and functions pin no. symbol function 1 i input ; block to ground directly at the ic with a ceramic capacitor. 2gnd ground 3q output ; block to ground with a 22 f capacitor, esr 3 ? . gnd aep01957 q p-to220-3-1 p-to263-3-1 gnd q aep02281 p-to252-3-1 aep02512 gnd q
tle 4274 data sheet version 1.3 4 2000-10-10 figure 2 block diagram 1 aeb01959 gnd 2 q 3 bandgap reference control amplifier sensor temperature buffer saturation control and protection circuit
tle 4274 data sheet version 1.3 5 2000-10-10 note: maximum ratings are absolute ratings; exceeding any one of these values may cause irreversible damage to the integrated circuit. absolute maximum ratings t j =?40to150 c parameter symbol limit values unit test condition min. max. voltage regulator input voltage v i ?42 45 v ? current i i ?? ? internally limited output voltage v q ?1.0 40 v ? current i q ? ? ? internally limited ground current i gnd ?100ma? temperature j unction temperature t j ?150 c? storage temperature t stg ?50 150 c?
tle 4274 data sheet version 1.3 6 2000-10-10 operating range parameter symbol limit values unit remarks min. max. input voltage; v50, dv50, gv50 v i 5.5 40 v ? input voltage, v85, gv85 v i 9.0 40 v ? input voltage, v10, gv10 v i 10.5 40 v ? j unction temperature t j ?40 150 c? thermal resistance j unction ambient r th j a ?65 k / w to220 j unction ambient r th j a ?78 k / w to252 1) j unction ambient r th j a ?52 k / w to263 1) j unction case r th j c ?4 k / w ? 1) w orst case; regarding peak temperature, z ero airflow mountedonpc b 80 80 1.5 mm 3 ,300mm 2 heat sink area.
tle 4274 data sheet version 1.3 7 2000-10-10 characteristics v i = 13.5 v; ? 40 c < t j < 150 c (unless otherwise specified) parameter symbol limit values unit measuring conditions min. typ. max. output voltage v50-version v q 4.8 5 5.2 v 5ma < i q < 400 ma 6v < v i < 40 v output voltage v85-version v q 8.16 8.5 8.84 v 5ma < i q < 400 ma 9.5 v < v i < 40 v output voltage v10-version v q 9.6 10 10.4 v 5ma < i q < 400 ma 11 v < v i < 40 v output current limitation 1) i q 400 600 ? ma ? current consumption; i q = i i ? i q i q ? 100 220 a i q =1ma current consumption; i q = i i ? i q i q i q ? ? 8 20 15 30 ma ma i q = 250 ma i q = 400 ma drop voltage 1) v dr ? 250 500 mv i q = 250 ma v dr = v i ? v q load regulation ? v q ? 2050mv i q =5mato 400 ma line regulation ? v q ? 1025mv ? v l =12vto32v i q =5ma power supply ripple re j ection psrr ?60?d b f r = 100 hz ; v r =0.5 v ss temperature output voltage drift ?0.5?mv/ k ? 1) measured when the output voltage v q has dropped 100 mv from the nominal value obtained at v i = 13.5 v. dv q dt -----------
tle 4274 data sheet version 1.3 8 2000-10-10 figure 3 measuring circuit figure 4 application circuit tle 4274 input 100 nf 100 f v c 2 1 c 22 f q 3 q aes01960 v q r l output tle 4274 c input 1 2 aes01961 c 3 q output
tle 4274 data sheet version 1.3 9 2000-10-10 drop voltage v dr versus output current i q current consumption i q versus output current i q (high load) output current i q versus input voltage v i current consumption i q versus output current i q (low load) typical performance characteristics (v50, v85 and v10): aed01962 0 0 dr v 200 400 600 mv 500 300 100 t j = 125 ?c q i 100 200 300 ma 400 = 25 ?c t j aed02267 0 0 q i q i 10 20 30 40 50 60 100 200 300 400 600 ma i v = 13.5 v ma = 25 ? c t j aed01963 0 0 v q = 0 v = 25 ? c t j i v q i 10 20 30 40 50 v 200 400 600 ma 800 aed02268 0 0 q i q i 0.1 0.2 0.3 0.4 0.5 0.6 10 20 30 40 ma 60 ma i v = 13.5 v = 25 ? c t j
tle 4274 data sheet version 1.3 10 2000-10-10 output voltage v q versus junction temperature t j output voltage v q versus input voltage v i current consumption i q versus input voltage v i input current i i versus input voltage v i typical performance characteristics (v50): aed01966 -40 04080 120 ? c 160 4.8 j t q v 5.2 v v i = 13.5 v 4.9 5.0 5.1 aed01968 0 246 8 v10 0 q v 2 4 6 v v i = 5 3 1 q v t j = 25 ? c l r = 20 ? i v v q 0 0 20 30 10 ma 50 aed02269 q 10 20 30 v r l = 20 ? v t j = 25 c aed01977 -50 -2 i v i i t = 25 ? c l r = 6.8 k -25 0 25 50 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ma v ? j
tle 4274 data sheet version 1.3 11 2000-10-10 output voltage v q versus junction temperature t j output voltage v q versus input voltage v i current consumption i q versus input voltage v i input current i i versus input voltage v i typical performance characteristics for v85: aed01970 -40 04080 120 ? c 160 j t q v 8.4 8.6 v v i = 13.5 v 8.3 8.2 8.5 8.7 8.8 6 4 08 0 2 4 r t q v q v 8 = v v 10 12 v 16 12 20 v = 25 c = 34 l j ? aed01972 q v 0 0 20 30 10 ma 50 aed02270 q 10 20 30 v r l = 20 ? v t j = 25 c aed03051 -50 -2 i v i i t = 25 ? c l r = 12 k -25 0 25 50 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ma v ? j
tle 4274 data sheet version 1.3 12 2000-10-10 output voltage v q versus junction temperature t j output voltage v q versus input voltage v i current consumption i q versus input voltage v i input current i i versus input voltage v i typical performance characteristics for v10: aed01974 -40 04080 120 ? c 160 9.7 j t q v 9.9 10.1 10.3 v v i = 13.5 v 10.2 9.8 10.0 aed01976 0 4812 16 v20 0 q v 4 8 12 v v i = 10 6 2 q v t j = 25 ? c l r = 34 ? i v v q 0 0 20 30 10 ma 50 aed02270 q 10 20 30 v r l = 20 ? v t j = 25 c aed03048 -50 -2 i v i i t = 25 ? c l r = 15 k -25 0 25 50 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 ma v ? j
tle 4274 data sheet version 1.3 13 2000-10-10 package outlines a b a 0.25 m typical 9.9 0.2 2.8 1) 15.65 0.3 12.95 0...0.15 2.54 0.75 0.1 1.05 0.1 1.27 4.4 b 9.25 0.2 0.05 1) all metal surfaces tin plated, except area of cut. c 0.2 17 0.3 8.5 1) 10 0.2 3.7 -0.15 c 2.4 0.5 0.1 0.2 4.55 13.5 0.5 3x metal surface min. x=7.25, y=12.3 0...0.3 2x 2.4 p-to220-3-1 (plastic transistor outline) sorts of packing package outlines for tubes, trays etc. are contained in our data b ook package information dimensions in mm
tle 4274 data sheet version 1.3 14 2000-10-10 gpt09051 5.4 0.1 -0.10 6.5 +0.15 a 0.5 9.9 6.22 -0.2 1 0.1 0.15 0.8 0.15 0.1 max per side 0.75 2.28 4.57 +0.08 -0.04 0.9 2.3 -0.10 +0.05 b min 0.51 0.1 1 +0.08 -0.04 0.5 0...0.15 b a 0.25 m 0.1 all metal surfaces tin plated, except area of cut. 3x p-to252-3-1 (plastic transistor single outline) sorts of packing package outlines for tubes, trays etc. are contained in our data b ook package information dimensions in mm smd = surface mounted device
tle 4274 data sheet version 1.3 15 2000-10-10 8 ? max. b a 0.25 m 0.1 typical 0.2 10 8.5 1) 7.55 1) (15) 0.2 9.25 0.3 1 0...0.15 5.08 2.54 0.75 0.1 1.05 0.1 1.27 4.4 b 0.5 0.1 0.3 2.7 4.7 0.5 0.05 1) 0.1 all metal surfaces: tin plated, except area of cut. 2.4 metal surface min. x=7.25, y=6.9 a 0...0.3 b gpt09057 p-to263-3-1 (plastic transistor single outline) sorts of packing package outlines for tubes, trays etc. are contained in our data b ook package information dimensions in mm smd = surface mounted device
tle 4274 data sheet version 1.3 16 2000-10-10 edition 2000-10-10 published by infineon technologies ag, st.-martin-strasse 53, d-81541 mnchen ? infineon technologies ag 2000. all rights reserved. attention please! the information herein is given to describe certain components and shall not be consid- ered as warranted characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non- infringement, regarding circuits, descriptions and charts stated herein. infineon technologies is an approved cecc manufacturer. information for further information on technology, deliv- ery terms and conditions and prices please contact your nearest infineon technologies office in germany or our infineon technolo- gies representatives worldwide (see ad- dress list). warnings due to technical requirements components may contain dangerous substances. for in- formationonthetypesinquestionplease contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the fail- ure of that life-support device or system, or to affect the safety or effectiveness of that de- vice or system. life support devices or sys- tems are intended to be implanted in the hu- man body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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